Next-Generation Cooling · Built for OEM & GSI Integration

Transcending the Thermal Limits of Computing

FrostByte is a breakthrough cooling platform that reduces heat at the point of generation — unlocking performance density, recovering throttled compute capacity, and eliminating the energy overhead of conventional cooling. Designed to be validated and integrated by OEMs and GSIs enabling the next generation of AI infrastructure.

FrostByte Core Module with copper thermal interface plate — shown next to a pen for scale

FrostByte Core Module — pen shown for scale

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The Challenge

Heat is the binding constraint on modern computing

Modern computing systems generate enormous amounts of heat. As processors become more powerful — and AI workloads push power densities far beyond traditional datacentre limits — thermal management has become the defining constraint on what computing can achieve.

When heat cannot be removed fast enough, the consequences cascade through the entire system:

Processors throttle performance below design specification
Energy efficiency declines — power is wasted on heat management
Hardware reliability decreases under sustained thermal stress
Infrastructure costs escalate as cooling systems grow in scale

The full potential of next-generation computing hardware is being left on the table.

40%

Of datacentre electricity consumption devoted to thermal management infrastructure — a direct OPEX and carbon burden FrostByte addresses

1,000W+

Thermal design power of next-generation AI accelerators — pushing system architectures beyond conventional limits

$250B+

Projected datacentre thermal management market by 2030 — awaiting a new category to own it

The Opportunity

A market ready for a new category

The numbers frame the urgency. Three figures define the scale of the problem — and the scale of the prize for the technology that solves it.

The Cooling Challenge

Conventional cooling treats the symptom, not the cause

Air cooling, liquid cooling, and immersion cooling all address heat after it accumulates. These cooling technologies improve heat removal — but they add infrastructure complexity, consume significant energy, and remain constrained by the same fundamental limitation: thermal management happens downstream of where heat is actually generated.

As power densities continue to climb, incremental improvements to existing cooling systems will not be sufficient. FrostByte represents the next category of cooling — one that operates at the source of heat generation rather than attempting to manage it after the fact.

Cooling system

Air / liquid / immersion — all downstream of the problem

Heatsink

Bulk heat spreading — limited by interface resistance

⟡ FrostByte

Thermal Performance Enablement — acting at the source

Processor die

Heat generation — where performance is constrained

The Mobius Vortex Approach

We asked a different question entirely

While the industry built progressively more elaborate systems to remove heat after it was generated, Mobius Vortex challenged the assumption underneath the entire field. The result — FrostByte — is a self-contained hardware suite that does not cool a chip. It reduces heat locally, at source, powered entirely by the thermal energy it consumes. There is nothing else like it.

01

Local Eradication

FrostByte does not move heat somewhere else. It reduces it at the point of generation — eliminating the thermal constraint before it can propagate through the system.

02

Self-Powered

FrostByte requires no external electricity. It harvests the thermal energy produced by the chip itself to power its operation — adding zero energy overhead to the system.

03

Independently Validated

FrostByte's performance has been verified by independent third-party laboratory testing. The benchmark data is real, reproducible, and available to qualified evaluators.

What This Enables

When heat is reduced at source, everything changes

↑ Perf

Sustained Peak Performance

Processors no longer throttle under sustained workloads. Systems operate consistently at or near their designed performance ceiling — not the thermally-limited floor.

⊞ Dens

Increased Compute Density

More processing power per rack unit. With the thermal ceiling raised, AI infrastructure operators can pack more compute into the same physical footprint.

⚡ Eff

Zero Added Energy Overhead

FrostByte draws no external power — it is energised entirely by the heat it consumes. For the first time, solving the thermal problem adds nothing to the energy bill.

↓ Infra

Reduced Cooling Infrastructure

With heat reduced locally, downstream cooling systems face dramatically lower thermal loads — reducing capital cost, operational complexity, and energy consumption.

⊕ Life

Extended Hardware Lifespans

Lower sustained chip temperatures reduce thermal stress on silicon — improving long-term reliability and compressing hardware replacement cycles.

∞ Scale

A Licensable Platform

Core IP underpinned by a freedom-to-operate analysis confirming genuine white space, with over 50 distinct patent claims identified across device, system, and method categories. Patent prosecution underway with Wilson Sonsini.

Featured Insights

Perspectives on the thermal frontier

Analysis

Why AI Compute Density is Hitting a Thermal Wall

→

Technology

Why Conventional Cooling Architectures Cannot Keep Pace with AI

→

Vision

The Future of Compute Density — a Thermal Perspective

→

Get Involved

Ready to explore the platform?

Whether you are an OEM, GSI, system integrator, investor, or technical evaluator — we welcome the conversation and offer confidential technical briefings by appointment.

Platform

A New Layer in System Performance Architecture

FrostByte is a next-generation cooling technology — a self-contained hardware suite that reduces heat locally at the point of generation, powered entirely by the thermal energy it consumes. It delivers a compound improvement in sustained performance, compute density, and energy efficiency unlike anything available in conventional cooling today.

The Breakthrough

The industry has been solving the cooling problem the wrong way

For decades, the response to rising chip temperatures has been the same: build better cooling systems to remove heat after it is generated. Air cooling gave way to liquid cooling. Liquid cooling gave way to immersion. Each generation more complex, more expensive, and more energy-hungry than the last.

Mobius Vortex challenged the fundamental assumption: instead of asking how to remove heat more efficiently downstream, we asked whether heat could be reduced at source — by a cooling system that powers itself from the very energy it consumes.

FrostByte is that answer. A new category of cooling that operates where the heat is born — delivering performance and efficiency gains that no downstream cooling approach can match.

White Space Confirmed

Freedom-to-operate analysis conducted by Wilson Sonsini — one of the world's leading technology IP firms — has confirmed that FrostByte operates in genuine white space. There are no blocking patents, no prior art, and no comparable technology anywhere in the commercial or research landscape. Over 50 distinct patent claims have been identified across device, system, and method categories. Patent prosecution is underway with Wilson Sonsini.

The Electricity Opportunity

Thermal management infrastructure currently accounts for approximately 40% of total datacentre electricity consumption. FrostByte's self-powered operation — drawing no external electricity — addresses this directly, delivering substantial reductions in electricity cost, operational expenditure, and carbon emissions at the infrastructure level.

How It Works

Before FrostByte. After FrostByte.

The shift is not incremental. It is architectural. FrostByte does not improve the existing approach — it replaces the fundamental premise.

How FrostByte Works

A self-contained system. Self-powered from the heat itself.

FrostByte is a hardware infrastructure suite that integrates into the chip system architecture. It harvests the thermal energy produced by the processor and converts it to power its own operation — reducing heat locally, with no external electricity required, and no downstream dependency on cooling infrastructure.

System Architecture — Before & After FrostByte

Conventional approach

Cooling plant

External power — high energy overhead

Liquid / immersion

Complex infrastructure — failure risk

Heatsink / TIM

Heat moved, not reduced at source

Processor

Heat generated — performance throttled

With FrostByte

Cooling plant

Dramatically reduced load

⟡ FrostByte Suite

Self-powered — harvests chip heat — reduces locally — zero external electricity

Processor

Heat reduced at source — sustained peak performance

The IP Position

A comprehensive claims landscape

Freedom-to-operate analysis conducted by Wilson Sonsini has confirmed that FrostByte occupies genuine white space — no blocking prior art, no comparable commercial product, and no published research that achieves anything analogous.

Over 50 distinct patent claims have been identified across device configurations, system architectures, and thermal management methods — spanning multiple independent claim families and covering the technology across device, system, and method categories. Patent prosecution is actively underway with Wilson Sonsini.

This IP programme has been built to support durable licensing across verticals and geographies — with the depth and breadth to create a genuinely defensible commercial position as the technology is deployed at scale.

50+ Patent Claims Identified

Across device, system, and method categories — providing multi-layered coverage of the core technology and its applications. Patent prosecution in progress with Wilson Sonsini.

Multiple Independent Families

Claims organised into independent families — providing redundancy, commercial breadth, and resistance to circumvention across the full scope of the invention.

True White Space — FTO Confirmed

Wilson Sonsini's freedom-to-operate analysis is complete. The field is clear. No blocking patents, no prior art, no comparable technology anywhere in commercial or research landscape.

Platform Model

Core technology. Licensed at scale.

Mobius Vortex develops and owns the FrostByte IP. The business model is built on licensing this technology into partner systems — enabling wide deployment while Mobius Vortex remains focused on advancing the science and prosecuting the patent programme with Wilson Sonsini.

FrostByte requires significant integration into the system architecture of partner hardware. This is by design — the deeper the integration, the greater the performance uplift, and the more defensible the licensing relationship.

Primary Target Vertical

AI / GPU Datacentre Infrastructure

The convergence of extreme power densities, unsustainable thermal performance ceilings, and massive capital investment makes AI infrastructure the highest-value first deployment for FrostByte. At 1,000W+ TDP for next-generation accelerators, and with ~40% of datacentre electricity currently consumed by thermal management, the commercial and sustainability urgency is acute. The addressable market exceeds $250B by 2030.

GPU licensing conversion is the first gate — all resources focus here until the first Tier-1 deal is executed.

Future Verticals — Post-GPU Roadmap

Medical Imaging

$45B market

MRI and CT thermal constraints — activated following first GPU licensing conversion.

EV Electronics

$380B market

EV inverter and motor thermal performance enablement — the next major vertical.

Robotics & Industrial

$62B market

Compact servo drive thermal limits — concurrent activation with EV given overlapping supply chains.

Explore the science behind the platform

Technology

A Scientific Breakthrough. Independently Validated.

FrostByte represents a genuine scientific discovery — an approach to the thermal constraint in computing that has no precedent in commercial products or published research. Its performance has been verified by independent laboratory testing. Its IP position has been confirmed as true white space by Wilson Sonsini, with over 50 patent claims identified and prosecution now underway.

The Discovery

Nothing like this has existed before

The computing industry has spent decades treating heat as a waste product to be managed — moved away from the chip and dissipated into the environment through progressively more complex and energy-intensive cooling infrastructure.

FrostByte rejects that paradigm entirely. It is a self-contained hardware suite that reduces heat locally, at the point of generation, powered by the thermal energy the chip itself produces. It does not move heat. It does not require external power. It consumes the problem.

Freedom-to-operate analysis conducted by Wilson Sonsini has confirmed that this approach occupies genuine white space. There is no blocking prior art, no comparable commercial product, and no published research that achieves anything analogous. This is a first.

The Fundamental Difference

Every existing thermal technology — from basic heatsinks to advanced immersion cooling — operates on the same principle: heat is generated, then removed. FrostByte operates on a different principle altogether. The distinction is not incremental. It is categorical.

Third-Party Validation

FrostByte's performance has been verified by independent laboratory testing. The benchmark data is reproducible and available to qualified engineering evaluators and partners under NDA. Claims are substantiated, not projected.

Performance

Core technology validation — ahead of internal projections

It is important to be precise about what has been measured and what has not. The University of Bristol's CDTR laboratory is currently conducting independent thermal characterisation of the FrostByte Core module — the core technology component — under controlled laboratory conditions. These are not yet system-level or infrastructure-level measurements.

Preliminary results are ahead of internal projections. The full characterisation report will be issued on completion of the programme. System-level performance within AI and HPC infrastructure architectures will be demonstrated separately through the GPU reference demonstrator programme.

Two Distinct Validation Stages

Stage 1 — currently underway at the University of Bristol CDTR — establishes the efficacy of the FrostByte Core technology. Stage 2 — the GPU reference demonstrator programme — will validate the performance of the full infrastructure stack as applied to real-world AI and HPC thermal problems. Both stages are required before performance claims at the infrastructure level are made publicly.

Stage 1

Core Module: Temperature Differential

Preliminary independent testing at the University of Bristol CDTR laboratory demonstrates a measurable temperature differential across the FrostByte Core module under controlled constant power input — confirming the core technology's thermal performance efficacy. Results are ahead of internal projections. Full characterisation data is available to qualified evaluators under NDA.

>20%

GPU Demonstrator: Clock Frequency Target

The GPU reference demonstrator programme targets greater than 20% recovery of GPU clock frequency at sustained load. This is a system-level infrastructure target, distinct from the core technology characterisation underway at Bristol, and will be validated independently prior to external disclosure.

Zero

Zero External Power Draw

FrostByte requires no external electricity — it is energised by the thermal energy it consumes. Addressing the thermal performance ceiling adds nothing to the system's energy overhead. At scale, this represents a substantial reduction in the ~40% of datacentre electricity currently consumed by thermal management.

40%

Datacentre Electricity Reclaimed

Thermal management infrastructure accounts for approximately 40% of total datacentre electricity consumption. FrostByte's self-powered architecture directly addresses this — with material implications for electricity cost, operational expenditure, and carbon emissions at infrastructure scale.

FTPI

FrostByte Thermal Performance Index

Mobius Vortex is establishing the FTPI — the FrostByte Thermal Performance Index — as the benchmark standard for thermal performance enablement. The category vocabulary is ours to define.

IP

IP Programme — In Progress

Over 50 distinct patent claims identified across device, system, and method categories following Wilson Sonsini's freedom-to-operate analysis. Patent prosecution actively underway. The field is confirmed clear — prosecution precedes any further external disclosure.

Competitive Position

Not a better version of what exists. A different category.

FrostByte does not compete with cooling technologies on their own terms. It renders the comparison itself obsolete — because it eliminates the need to remove heat at all.

Characteristic	Air Cooling	Liquid / Immersion	FrostByte
Operating principle	Heat removal	Heat removal	Heat reduction at source
External power required	Yes — fans, chillers	Yes — pumps, cooling plant	None — self-powered
Energy overhead	Moderate	Significant	Zero
Heat destination	Environment (downstream)	Environment (downstream)	Eradicated locally
System integration	External infrastructure	External infrastructure	Embedded hardware suite
Performance at sustained load	Throttling under peak	Throttling under peak	Sustained peak throughput
Prior art / precedent	Decades of prior art	Decades of prior art	Genuine white space — FTO confirmed by Wilson Sonsini
Patent status	Crowded field	Crowded field	50+ claims identified — prosecution underway with Wilson Sonsini

IP Programme

A scientific breakthrough with a clear path to protection

The FrostByte IP programme has been built with the same rigour as the underlying science. Freedom-to-operate analysis is complete. The claims landscape has been mapped. Prosecution is underway.

50+

Distinct patent claims identified

Spanning device configurations, system architectures, and thermal management methods — covering the technology comprehensively across all three categories. Patent prosecution actively underway with Wilson Sonsini.

Multi

Multiple independent claim families

Providing defensive depth and commercial breadth — making the eventual estate highly resistant to circumvention while enabling flexible licensing structures across verticals and geographies.

FTO

Freedom to operate confirmed

Wilson Sonsini's analysis confirmed true white space — no blocking patents, no prior art, and no comparable technology anywhere in the commercial or research landscape. The field is open.

"The field is open. The science is proven. Prosecution is underway."

Validation

Building Scientific and Engineering Validation

Technical claims must be substantiated with rigorous, reproducible data. Mobius Vortex is committed to a structured validation programme that builds a credible evidence base for the FrostByte platform.

Our Framework

A four-stage validation programme

S1

Laboratory Testing

Controlled experiments measure thermal transport performance, repeatability, and material consistency under defined conditions. Results are compared against baseline thermal interface materials and published industry benchmarks. The foundation of our evidence base.

S2

Benchmark Comparison

Performance is evaluated against established industry solutions across a range of power densities and operating conditions. An objective, independently reproducible basis for performance claims — enabling prospective partners to compare on a like-for-like basis.

S3

Engineering Validation

Integration testing within representative hardware platforms validates real-world performance under operational conditions — including thermal cycling, sustained-load testing, and environmental stress protocols. Bridging the gap between laboratory performance and production behaviour.

S4

System-Level Demonstrators

A reference demonstrator system illustrates end-to-end integration and quantifies system-level impact — the performance and efficiency gains achievable with FrostByte deployed at the platform level. Qualified partners and evaluators can request access to the demonstrator programme.

Internal Development Testing

Building the validation infrastructure

Ahead of independent laboratory testing, the Mobius Vortex team designed and built a series of custom test rigs and instrumentation systems to characterise FrostByte performance internally. The images below document that development programme — from early multi-channel breadboard rigs and custom thermal test chambers through to IR thermal imaging, microscopy at the University of Bristol, and a portable self-contained validation case for field deployment.

Multi-channel test rig — early prototype wiring harness

Touchscreen data display showing live test channel readings

Thermal test chamber with Arduino control board

Interior of insulated test chamber with active heat source

Test chamber exterior with instrumentation panel

Arduino control board with real-time LCD temperature display

FrostByte core module under Leica DMLM microscope on Renishaw encoded stage

Insulated test chamber — open configuration

Data acquisition: live capture software alongside advanced test rig

Multi-sensor control board with thermal test chamber

IR thermal camera — comparative heat source analysis

IR thermal overlay — heat distribution at the module interface

Portable validation case — full self-contained test system

High-power load resistors and switching assembly

Independent Validation

University of Bristol — CDTR Laboratory

Independent thermal characterisation of the FrostByte Core module is underway at the University of Bristol's Centre for Device Thermography and Reliability (CDTR) — one of the UK's leading thermal characterisation facilities. The programme is being conducted under a formal methodology protocol supplied by Mobius Vortex.

Preliminary Results

Preliminary results from the University of Bristol CDTR programme are ahead of internal projections. The full thermal characterisation report will be issued on completion of the programme and will form the basis of validated performance claims for external disclosure. Results to date confirm the core technology is performing ahead of expectations. Full data will be disclosed following completion of the programme and in accordance with the IP prosecution timeline.

Validation Principle

No performance claim is disclosed externally before independent validation is complete, and no validated result is disclosed before the underlying patent applications are in progress. This sequencing — prosecute, validate, disclose — is a core operating principle of Mobius Vortex: the IP programme advances in step with the science.

Technical Resources

Validated performance data is available to qualified engineering evaluators and prospective partners under NDA. Enquiries from OEM engineering teams, system architects, and institutional investors are welcomed.

Request access to technical data

Qualified engineering evaluators and prospective partners can request a confidential technical briefing, including early validation data.

Integration

Designed for Real-World Systems

FrostByte is designed from the outset to integrate into existing and next-generation computing architectures with minimal disruption to established manufacturing and assembly processes.

Applications

Where FrostByte fits

GPU Compute Modules

Direct integration at the die-to-heatspreader interface — enabling sustained higher clock speeds during intensive AI and HPC workloads.

High-Performance Servers

Rack-level thermal performance uplift — allowing greater compute density within existing cooling infrastructure.

Specialised ASIC Platforms

Tailored integration for custom silicon — where thermal performance at the chip level is critical to system capability.

Edge Computing Nodes

Enabling greater compute density in thermally constrained environments — without increasing chassis size or cooling infrastructure.

Next-Gen AI Accelerators

Designed to complement upcoming chip architectures operating at extreme power densities — where conventional thermal interface materials cannot keep pace.

Industrial & Embedded Computing

High-reliability thermal management for compute platforms in thermally constrained or ruggedised environments.

How It Works

The integration pathway

01

Technical Assessment

Mobius Vortex engineers evaluate the target system architecture, thermal requirements, and integration constraints. An initial performance model is produced, quantifying projected gains for the specific platform.

02

Integration Design

A tailored integration solution is designed and specified for the target platform — aligning with existing manufacturing and assembly processes to minimise disruption and time-to-integration.

03

Prototype and Test

Prototype integration is built and validated against the partner's performance requirements. Results are documented and compared to the initial performance model to confirm real-world efficacy.

04

Production Pathway

A production integration specification and supply chain pathway is established for at-scale deployment — enabling partners to move from prototype to production efficiently.

Demonstrator Programme

See integration in action

Mobius Vortex is developing a reference demonstrator system that illustrates integration feasibility and quantifies system-level impact. Qualified partners and evaluators can request access to the demonstrator programme — providing a concrete, reproducible evidence base for integration planning.

Licensing & Partnerships

A Platform Designed for Industry Collaboration

Mobius Vortex develops and owns the core FrostByte IP. The business model is built on licensing this technology into partner systems — enabling wide deployment while Mobius Vortex remains focused on advancing the core science.

Engagement Pathway

From introduction to licensing agreement

01

Technical Introduction

A confidential briefing covering the FrostByte platform, performance data, and integration pathway.

02

Evaluation

Joint evaluation of fit against partner requirements, including architecture review and performance modelling.

03

Integration Planning

Detailed integration design, prototype build, and validation programme tailored to the partner platform.

04

Licensing Agreement

Formal licensing arrangement covering IP use rights, production specifications, and royalty structure.

The GPU Spearhead

The most demanding thermal environment in the world — first

Mobius Vortex has made a deliberate strategic choice: GPU and AI datacentre infrastructure is the primary spearhead. It is the vertical where the thermal performance ceiling is most acute, the commercial urgency is highest, and a successful licensing conversion creates the credibility and leverage to activate every subsequent vertical.

$250B+

Datacentre thermal management market by 2030

40%

Of datacentre electricity consumed by thermal management — OPEX and carbon directly in scope

1,000W+

Next-gen GPU thermal design power — a new architecture problem

Partner Categories

Who we work with

Semiconductor Companies

Chip designers and semiconductor manufacturers seeking to deliver improved thermal performance with next-generation silicon.

Datacentre Operators

Hyperscale and enterprise datacentre operators looking to improve compute density and energy efficiency at infrastructure scale.

System OEMs

Server and system manufacturers looking to differentiate their products with superior thermal performance capabilities.

AI Accelerator Developers

Companies building next-generation AI compute platforms where thermal performance is a critical design constraint.

Research Institutions

Academic and national laboratory HPC facilities seeking to push the boundaries of compute density within thermal and power budgets.

Industrial & Embedded

System integrators in industrial and embedded computing sectors requiring high-reliability thermal solutions for demanding environments.

Investor Relations

An investment opportunity at the intersection of AI and climate technology

Mobius Vortex is building a proprietary deep-technology platform with a compelling licensing model at the intersection of two of the largest investment themes of the decade: AI infrastructure and climate technology.

The FrostByte platform addresses a fundamental bottleneck in the AI compute stack with a novel, physics-level approach. The IP is proprietary, the market is large and growing, and the timing is compelling.

Investor Enquiries

Interested institutional and strategic investors are invited to request a confidential presentation covering the technology roadmap, market opportunity, business model, and team. All enquiries are treated with strict confidence.

Insights & Resources

Perspectives on the Thermal Frontier

Analysis, technology explainers, and industry commentary from the Mobius Vortex team — exploring the intersection of thermal physics, AI infrastructure, and next-generation computing.

Analysis

Why AI Compute Density is Hitting a Thermal Wall

As AI workloads push GPU and accelerator chip power densities beyond 700W/cm², the thermal constraint has become the defining bottleneck in next-generation AI infrastructure deployment.

→

Technology

Why Cooling Alone Cannot Solve the Future Compute Challenge

Incremental improvements to cooling infrastructure are no longer sufficient. The industry requires a fundamentally different approach — one that acts at the source of heat generation.

→

Vision

The Future of Compute Density — a Thermal Perspective

Looking ahead to the next decade of AI infrastructure: where thermal performance enablement becomes a competitive differentiator for hyperscale operators and chip designers alike.

→

Engineering

Solid-State Thermal Solutions — Why the Approach Matters

The case for solid-state thermal solutions in production AI infrastructure: reliability, maintenance profiles, and the limits of liquid-based approaches at hyperscale.

→

Analysis

From Thermal Management to Thermal Performance: A New Category

How a shift in framing — from managing heat to enabling performance — opens up a fundamentally different design space for computing system architects.

→

Sustainability

The Energy Cost of Compute Heat — and How to Reduce It

AI infrastructure's growing energy footprint is substantially driven by thermal inefficiency. Quantifying the energy cost and exploring the role of thermal performance in sustainable compute.

→

About · Why Frostbyte

Built to Solve a Fundamental Problem in Cooling

Mobius Vortex was founded to address the growing thermal limitations facing modern computing infrastructure — not by improving existing cooling, but by operating at the physics level where heat originates. This is a new category of cooling.

To remove the thermal limits of computing — not by managing heat better, but by reducing it at source. A discovery that changes what AI infrastructure can achieve, and what it costs the planet to run it.

Pioneering

We discovered something the field had missed

FrostByte is a scientific breakthrough — not an engineering iteration. The approach has no precedent in commercial products or research literature, confirmed by a comprehensive freedom-to-operate analysis conducted by Wilson Sonsini. The identification of 50+ distinct patent claims across device, system, and method categories — with prosecution underway with Wilson Sonsini — reflects the depth and originality of the underlying discovery.

Contrarian

We challenged what the industry had accepted

The computing industry has spent decades assuming that heat is a waste product to be removed — and building progressively more complex and energy-intensive infrastructure to remove it. Mobius Vortex rejected that assumption and asked a different question: what if heat could be reduced at source, by a system that powers itself from the very energy it consumes?

Mission-Driven

Solving compute and climate in a single move

AI infrastructure's energy consumption is one of the defining sustainability challenges of the decade. A significant proportion of that energy is consumed not by computation, but by the systems required to manage the heat that computation produces. FrostByte reduces heat locally with zero external power draw — reducing the energy burden of AI infrastructure at the point of its greatest inefficiency.

The Team

The Mobius Vortex team

Mobius Vortex team collage — people and technology

The Mobius Vortex team

The Team

Leadership

Rory Davies

CEO, Director

Experienced technology leader with a track record of driving innovation and business growth across software development, telecommunications, and enterprise solutions. Oversees the company's vision, strategy, and operational execution.

M. Parvez Hamid

CTO, Co-Founder, Director

Co-originator of the FrostByte IP with a background spanning IT, engineering, manufacturing, and energy efficiency. Leads R&D with deep hands-on experience in laboratory product development and strict quality control protocols.

Gemma Ransley

Chair, Corporate Director

Results-driven professional with nine years of international operational leadership across the Middle East and USA. Leads the Board of Directors, ensuring governance alignment and strategic execution across the company.

James Whale

Chair, Advisory Panel

Seasoned C-Suite executive with global experience across four continents, including senior roles at IBM and Thomson Reuters. Specialist in taking companies from inception to IPO or trade sale in high-growth technology sectors.

Brent McCray

Snr Advisor - Commercial

Visionary global executive with 30+ years driving multi-billion-dollar growth across technology, telecom, and emerging sectors at Intel, Amdocs, and multiple venture-backed startups across four continents. Expert in forging strategic alliances, unlocking enterprise markets, and turning breakthrough technology into measurable commercial outcomes.

George Dickson

Snr Advisor - Market entry

George Dickson has a 40 year business career. Mr Dickson has worked in the C-suite most of his career. A true entrepreneur who loves technology specializing in AI, data centers, energy, disaster mitigation, and Med tech.

Jeremy Coast

Programme Manager

Accomplished project manager and design consultant with extensive experience steering large-scale programmes in ICT. Background includes software delivery for Norwich Union and telecoms systems design for British Telecommunications.

James Rider

Market Strategy, Advisory Panel

Consultant specialising in go-to-market strategy, business development, and tech commercialisation. Began his career at Quantum Sphere Ltd. across renewables, energy generation, and AI — where he first worked alongside the Mobius Vortex team.

Join the Team

Mobius Vortex is building a world-class team at the intersection of physics, engineering, and commercial strategy. If you are passionate about removing the thermal limits of computing, we would welcome a conversation. jobs@mobiusvortex.com

Company Story

A discovery. Then a company.

Mobius Vortex did not begin with a market opportunity. It began with a scientific breakthrough — a discovery that challenged one of the most deeply entrenched assumptions in computing: that heat generated by a processor must, by necessity, be removed.

The founders asked a different question. What if the heat itself could be the solution — harvested at source, converted to power the reduction process, and eliminated locally before it could constrain the system? The result was FrostByte: a self-contained hardware suite that does exactly that, with no external power draw and no downstream cooling dependency.

Freedom-to-operate analysis conducted by Wilson Sonsini confirmed what the founders suspected: this was genuine white space. No comparable technology existed in commercial products or published research. The company was built to bring that discovery to market — starting with AI and GPU datacentre infrastructure, where the thermal constraint is most acute and the commercial opportunity is largest.

Contact

Let's Start the Conversation

Mobius Vortex welcomes enquiries from prospective partners, investors, research collaborators, and media organisations. All enquiries are treated with strict confidence.

Enquiry Types

We welcome enquiries from:

01

Industry Partners

Semiconductor companies, datacentre operators, system OEMs, and AI accelerator developers interested in licensing or co-development.

02

Investors

Institutional and strategic investors interested in the deep technology licensing opportunity in AI infrastructure and climate technology.

03

Research Collaborators

Academic institutions, national laboratories, and research organisations interested in scientific collaboration and validation partnerships.

04

Media & Analysts

Technology journalists, industry analysts, and media organisations seeking background briefings on Mobius Vortex and the thermal performance enablement market.

Get in Touch

Send an enquiry

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